STMicro Announces GSM/GPRS Transceiver Module

Geneva – STMicroelectronics (NYSE:STM) has announced Triple-Band GSM/GPRS Transceiver modules that apply Silicon-Germanium radio frequency BiCMOS and Integrated Passive & Active Device (IPAD) technologies to simplify terminal design; the modules also set a new record for compactness.

In a 1.4 x 7 x 7mm low-profile Ball Grid Array package, the new modules integrate all of the key functions, requiring only a 26MHz crystal and a power amplifier to build a complete triple-band solution from antenna to baseband interface. Two versions are offered: type STw3100 addresses the European EGSM900, DCS1800, and PCS1900 bands while the STw3101 targets the US GSM850, DCS1800, and PCS1900 bands. The transceiver modules are compatible with the STMicroelectronics STw3102 power-amplifier module and most of the standard power amplifiers available on the market.

The foundation of these modules is a highly-integrated chip containing the transmitter, receiver, low-noise amplifier (LNA), voltage-controlled oscillator (VCO), digitally-controlled crystal oscillator (DCXO), and synthesizer block. Around this chip the modules also integrate the receive bandpass filters, RLC components for matching, phase-locked loop filtering, decoupling, and DC blocking functions.

By using ST's IPAD technologies and providing a complete solution in a single package, the STw3100 and STw3101 modules reduce the RF component count of a typical mobile phone from around 80 to just five. As a result, the area needed on the printed circuit board is roughly five times smaller, design is simplified, RF tuning is easier, fewer parts need to be stocked, manufacturing yields are higher, and assembly is faster. Reduced board area also allows phone manufacturers to add additional functions such as FM radio, digital TV, Bluetooth, WiFi, image sensors, and multimedia application processors without increasing the size or weight of the phone.

"We have achieved this unprecedented level of integration thanks to ST's broad portfolio of advanced RF technologies, including silicon-germanium BiCMOS for RF chips, acoustic wave technology for receive filtering, IPAD technology for passive integration, and laminate technology for module integration," commented Loic Lietar, General Manager of ST's Cellular Terminals Division. "Combining these technologies optimizes performance and cost. At the same time we've eliminated the manufacturing risk because these processes are proven in volume production and ready for fast ramp up."

ST is developing further RF transceiver modules to address new market needs, adding EDGE and 3G. A broad range semiconductor supplier, ST supplies a complete range of components for mobile phones, including chipsets for GSM/GPRS and CDMA, multimedia application processors, CMOS image sensors, and MEMS accelerometers.

For more information www.st.com/wireless